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Intelligent Power Modules Global Market - Segmentation, Application, Technology, Analysis and Forecast 2018 to 2023
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Intelligent power modules are high voltage integrated devices which are capable of delivering high voltage output of more than 1200V over a single SIP (system-in-package) module. The output voltages are transmitted through IGBT (Insulated Gate Biased Transistor) for gate shutdown at abnormal conditions, which acts as protection for the circuit. The features of intelligent power modules are overcurrent protection circuit, under-voltage lockout for various channels, motor control system, upper or lower prevention circuits and many more. These devices can be integrated into many applications like controllers, network processors, low noise applications, embedded computing, and many more.
The rising demand for Intelligent Power Modules Market in consumer electronics is majorly driving the market. The high performance and high voltage level shifting of intelligent power modules are increasing the demand for consumer electronics like air conditioners, washing machines, refrigerators, and many more. The rising trend of renewable energy resources and hybrid automotive are fuelling the growth of intelligent power modules. The emerging trends in the electronics industry and demand for GaN and SiC power semiconductors might power the market through the forecast period. However, the low adoption rate of power electronic devices and high power dissipation of small IGBT modules are hampering the market growth.
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The global intelligent power modules market is estimated to grow up to USD 3 billion at CAGR 11% through the forecast period 2023
Major Key Players:
- Mitsubishi Electric Corp. (Japan)
- Fuji Electric Co., Ltd. (Japan)
- Semikron (Germany)
- Infineon Technologies AG (Germany)
- ON Semiconductor Corporation (U.S.),
- STMicroelectronics N.V. (Switzerland)
- ROHM Co., Ltd. (Japan)
- Sanken Electric Co., Ltd. (Japan)
- Fairchild Semiconductor International, Inc. (U.S.)
- Future Electronics Inc. (Canada)
- Renesas Electronics Corporation (Japan)
- Texas Instruments (U.S.)
- Digi-Key Electronics (U.S.)
- NXP Semiconductors (the Netherlands)
- Taiwan Semiconductor (Taiwan)
- Hon Hai Precision Industry Co., Ltd (Taiwan)
- Samsung Electronics (South Korea)
- Panasonic Corporation (Japan)
- Intel Corporation (U.S.) and others.
The market for global intelligent power modules market is segmented into voltage rating, current rating, circuit configuration, power device, application areas, and region. On the basis of voltage rating, the segment is further classified as, up to 600V, 601-1200V and more than 1200V. On the basis of the current rating, the segment is further classified into up to 100A, 101-600A, and more than 600A. On the basis of the circuit configuration, the segment is further classified into 6-pac, 7-pac, dual, Phase Bridge, and others. On the basis of power device the segment is further classified into IGBT (Insulate Gate Bi-Polar Transistor) and MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). On the basis of application areas, the segment is further classified into consumer electronics, automotive, renewable energy, servo drives, UPS, and others.
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